Minimum Conductor Widths For PCBs Temperature Rise Above Ambient 2 oz Copper
Amperage	Ambient Temperature	Conductor Width
1 AMP	45C (113F)	.003
1.5 AMP	45C (113F)	.006
2 AMP	45C (113F)	.008
3 AMP	45C (113F)	.013
4 AMP	45C (113F)	.020
5 AMP	45C (113F)	.025
6 AMP	45C (113F)	.030
7 AMP	45C (113F)	.040
10 AMP	45C (113F)	.060

Notes :

1. The design chart has been prepared as an aid in estimating temperature 
   rises (above ambient) vs. current for various cross sectional areas of etched 
   copper conductors. It is assumed that, for normal design, conditions prevail
   where the conductor surface area is relatively small compared to the adjacent
   free panel area.  The curves as prsented include a nominal 10% derating (on
   current basis) to allow for normal variations in etching techniques, copper 
   thickness, conductor width estimates, and cross sectional area.

2. Additional derating of 15% (current wise) is suggested under the following
   conditions:
   (a) For panel thickness of 0.8 mm (1/32 in) or less
   (b) For conductor thickness of 108 um (3 oz/ft 2r) or thicker

3. For general use the permissible temperature rise is defined as the difference
   between the ambient temperature and the maximum sustained operating temperature
   of the assembly.

4. For single conductor applications the chart may be used directly for determining
   conductor thickness, cross sectional area, and current-carrying capacity for various
   temperature rises.

5. For groups of similar parallel conductors, if closely spaced, the temperature
   rise may be found by using an equivalent cross section and an equivalent current.  
   The equivalent cross section is equal to the sum of the cross section of the
   parallel conductors, and the equivalent current is the sum of the currents in the
   conductors.
 
6. The effect of heating due to attachment of power dissipating parts is not included.

7. The conductor thickness in the design chart do not include conductor overplating
   with metals other than copper.