Under construction.
Disclaimer;
These are independent values and are only an experience based
opinion. Use these values at your own discretion.
All dimensions are finished. Make a note that Manufacturer shall adjust artwork to
accomplish the finished value. Also Manufacturer shall note on all films adjustments made.
(If you want to use the film elsewhere, you need this)
Grey text detonates "needs further verification"
| Spec. |
Standard |
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| Voltage Isolation z-axis (Standard FR-4) |
1Kv per Mil |
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| Wall plating |
.005" (+/-.001) Do current calcs.
on .004" |
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| Drill to Drill Data |
.004" |
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| Drill to Pad (Top layer) |
.005" |
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| Drill Min. (lower is micro vias) |
.008" Finished |
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| Layer to Layer registration |
.004" (Top layer to all layers) |
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| Top layer registration |
.002 per inch .005" overall |
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| Finished Hole Tolerance |
18-80 2% 81Up 3% |
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| Annular ring External (PLTH) |
.003"+Mfg.tol{.008"standard}
(from finished hole) |
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| or Pad Dia. |
Hole Dia+.006"+.016=Pad Dia. |
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| Annular rign External (NPTH) |
.006"+Mfg.tol{.008"standard}
(from finished hole) |
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| or Pad Dia. |
Hole Dia+.0012"+.016=Pad Dia. |
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| Annular ring Internal (PLTH) |
.002"+Mfg.tol{.008"standard}
(from finished hole) |
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| or |
Hole Dia+.004"+.016"=Pad Dia. |
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| Via Annular ring |
.002"+Mfg.tol{.008"standard}
(from finished hole) |
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| or |
Hole
Dia+.004"+.016"=Pad Dia. |
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| Plane swell |
Drill-to-1st layer tolerance + layer to
layer tolerance + hole plating = Swell |
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| Plane/Trace to edge clearance (Routed edges only) |
.010"-.020"(.005 for route +
.005 for registration + Trace clearance) |
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| Mask Thickness Standard |
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| Mask Thickness Tolerance |
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| Mask Registration Tolerance (LPI) |
+/-.003" |
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| Mask Growth |
.005"-.004" |
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| Silk Registration Tolerance |
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| Bow & Twist |
.010" Avg. - .075" Tight |
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| Standard Route radius (Internal) |
.032" Min |
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| Annular Ring (External) |
.004" (May have isolated 20% reduction |
.004" (May have isolated 20% reduction |
.004" (May have isolated 20% reduction |
| Annular ring (Internal) |
User specified (Default .002" min) |
User specified (Default .002" min) |
User specified (Default .002" min) |
| Bow & Twist |
User specified (Default 1.5% max) |
User specified (Default 1.0% max) |
User specified (Default 0.5% max) |
| Cleanliness |
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| Conductor Pattern |
User specified (Not reduced more than 10%) |
User specified (Not reduced more than 10%) |
User specified (Not reduced more than 10%) |
| Conductor Thickness |
User specified (Not reduced more than 10%) |
User specified (Not reduced more than 10%) |
User specified (Not reduced more than 10%) |
| Conductor Width Internal/External |
User defined >.004" |
User defined >.004" |
User defined >.004" |
| Conductor Spacing Internal/External |
User specified (default is by voltage and/or table 3-1 IPC-275)
>.004" |
User specified (default is by voltage and/or table 3-1 IPC-275)
>.004" |
User specified (default is by voltage and/or table 3-1 IPC-275)
>.004" |
| Construction Mixed base Laminate |
(F) QPL for 55110 |
(F) QPL for 55110 |
(F) QPL for 55110 |
| Continuity |
Qualification 5ohm Max. Production 10ohm Max. |
Qualification 5ohm Max. Production 10ohm Max. |
Qualification 5ohm Max. Production 10ohm Max. |
| Cracks |
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| Cu Plating |
None |
None |
None |
| Plating Voids |
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| Delamination |
Shall meet sub-surface imperfection requirements (A>3.5.1.3) |
Shall meet sub-surface imperfection requirements (A>3.5.1.3) |
Shall meet sub-surface imperfection requirements (A>3.5.1.3) |
| Dielectric layer thickness |
User specified (default .0035" Min. |
User specified (default .0035" Min. |
User specified (default .0035" Min. |
| Dielectric withstanding Voltage |
No flashover, sparkover or breakdown. 1000VDC for 30Sec. |
No flashover, sparkover or breakdown. 1000VDC for 30Sec. |
No flashover, sparkover or breakdown. 1000VDC for 30Sec. |
| Edges of PWB |
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| Etchback |
.0002-.003" (.0005" preferred) negative etchback not allowed. |
.0002-.003" (.0005" preferred) negative etchback not allowed. |
.0002-.003" (.0005" preferred) negative etchback not allowed. |
| Hole pattern accuracy |
User specified |
User specified |
User specified |
| Hole Solderability |
J-STD-003 |
J-STD-003 |
J-STD-003 |
| Isolations |
Resistance between isolated conductors >2Mohms (100V test) |
Resistance between isolated conductors >2Mohms (100V test) |
Resistance between isolated conductors >2Mohms (100V test) |
| Laminate Voids |
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| Lifted Lands |
None allowed |
None allowed |
None allowed |
| PWB dimensions |
User specified |
User specified |
User specified |
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